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HDI High Step PCB for Computer

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Origin

China Mainland
Minimum Order

1
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Description

Product Detail

Basic Info

Model NO.: HDI43
Dielectric: FR-4
Application: Computer
Mechanical Rigid: Rigid
Base Material: Copper
Layer: 4
Min Hole: 0.3mm

Type: Rigid Circuit Board
Material: Fiberglass Epoxy
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Insulation Materials: Epoxy Resin
Thickness: 2.0mm
Surface: Enig

Product Description

HDI High Step PCB for Computer

Parameters
Layers: 4

Thicknes: 2±0.2mm

Min. Hole Size: 0.3mm

Width/Space: 0.152mm/0.175mm

Surface Treatment: ENIG

Crafts
PTFE Hybrid with FR4

Step Slot

Avoiding Solder Mask Peeling off Techonology

Applications
Power Amplifier of Communication Base Stations

HDI High Step PCB for Computer

Items	Speci.	Remark
Max panel size	32" x 32"(800mm x 800mm)
Min trace width/ space (inner layer)	4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)	5 mil(0.13mm)	hole ring width
Min thickness(inner layer)	4 mil(0.1mm)	without copper
Inner copper thickness	0.5~4 oz
Outer copper thickness	0.5~6 oz
Finished board thickness	0.4-3.2 mm
Board thickness tolerance control(±0.10 mm)	±0.1 mm	1~4 L
Finished board thicknes(±10%)	±10%	≥6 L
Inner layer treatment	Brown oxidation
Layer count Capability	1-24 LAYER
Alignment between ML	±2mil
Min drilling	0.15 mm
Min finished hole	0.1 mm
Hole precision	±2 mil(±50 um)
Tolerance for Slot	±3 mil(±75 um)
Tolerance for PTH	±3 mil(±75um)
Tolerance for NPTH	±2mil(±50um)
Max Aspect Ratio for PTH	8:1
Hole wall copper thickness	15-50um
Alignment of outer layers	4mil/4mil
Min trace width/space for outer layer	4mil/4mil
Tolerance of Etching	+/-10%
Thickness of solder mask(on trace)	0.4-1.2mil(10-30um)
Thickness of solder mask(at trace corner)	≥0.2mil(5um)
Thickness of solder mask(on base material)	Finished thickness+1.2mil
Hardness of solder mask	6H
Alignment of solder mask film	±2mil(+/-50um)
Min width of solder mask bridge	4mil(100um)
Max hole with solder plug	0.5mm
Surface finish	HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP,
Max Nickel thickness for Gold finger	280u"(7um)
Max gold thickness for Gold finger	30u"(0.75um)
Nickel thickness in Immersion Gold	120u---240u"(3um----6um)
Gold thickness in Immersion Gold	1u"---5u"(0.025um----0.125um)
Impedance control and its tolerance	50±10%, 75±10%,100±10% 120±10%
Trace Anti-stripped strength	≥61B/in(≥107g/mm)
Bow and twist	0.75%

Main Equipment

pcb equ.jpg

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Our Service

HDI High Step PCB for Computer

"Meet what customer need" is our service principle and "Quick response, Professional Service
& Strive for the best" is our service guideline.
Our sales and customer service team is always ready to answer your questions-provide quota
tion within 4 hours after receiving quotation information, track and report the status of product
whenever, on-time shipping etc.